Lithography/UV Aligner. This model is a contact, proximity lithography machine that can be aligned for exposure on both sides.
Substrate size: 5mm*5mm～100mm*100mm chip; Φ2"～Φ6" wafer;
Mask size: 2.5"～7"
Alignment accuracy: ± 0.5μm
It can be applied to the research and development and production of MEMS devices, thin film transistors, infrared sensors, lasers and other semiconductor products. It is suitable for various substrate materials such as Si, GaN, GaAs, InGaAs, InP, quartz wafers, sapphire wafers, etc., and suitable for different substrate sizes such as chips and wafers.